Fuji Seal-Glo Adhesives
The Seal Glo series includes epoxy adhesives, UV curing materials, and conformal coatings tailored for high-speed production and advanced electronic applications.
Adhesive for Chip Devices
High-performance adhesives for chip bonding and SMT assembly, designed for precise dispensing and fast curing. Ideal for electronic manufacturing requiring stability and reliability. Suitable for PCB assembly, semiconductor processing, and industrial electronics.
Underfill For BGA/CSP
Underfill adhesives designed to enhance the mechanical strength and reliability of BGA and CSP packages. Provides excellent thermal resistance and long-term protection. Widely used in PCB assembly, semiconductor packaging, and high-reliability electronics.