LTE-KZ100 Vacuum Chamber

LTE-KZ100 Vacuum Chamber Plasma Cleaner

LTE-KZ100

Description

The LTE-KZ100 Vacuum Chamber Plasma Cleaner utilizes an excitation power source to ionize gases, creating a plasma state. This plasma interacts with the product surface to effectively remove contaminants and enhance surface activity, significantly strengthening the quality of subsequent bonding and coating processes. Plasma cleaning is a cutting-edge, eco-friendly, highly efficient, and stable surface treatment technology.

Features

  • Flexible Fixture Design: Highly adaptable fixture designs that can accommodate a wide variety of irregular product shapes.
  • Horizontal Electrode Structure: Specifically optimized for the treatment of flexible products and substrates.
  • Energy and Gas Efficiency: Engineered for low energy and low gas consumption, ensuring both cost-effectiveness and sustainability.
  • User-Friendly Interchangeable Fixtures: Features a convenient swappable fixture plate design for streamlined operations.
  • Integrated Vacuum System: A fully integrated system with a compact footprint, effectively optimizing factory floor space.
  • Optimized Reaction Chamber: The plasma reaction chamber is precisely engineered to ensure highly uniform treatment results.
  • All-in-One Control System: Equipped with an intuitive and user-friendly operation interface for simplified management.

Industry Applications

  • PI (Polyimide): Surface roughening and cleaning.
  • PSS (Patterned Sapphire Substrate): Etching treatment.
  • ITO Conductive Film: Precision etching processes.
  • Semiconductors: Removal of PN junctions from silicon wafers.
  • Wire Bonding: Pre-cleaning of pad surfaces prior to bonding.
  • HDI Boards: Removal of smear from hole bottoms and walls.
  • PCB: Desmearing in holes and general surface cleaning.
  • Coverlay: Surface roughening and cleaning.
  • Teflon Boards: Surface activation and hole desmearing.
  • Rigid-Flex Boards: Hole desmearing and surface cleaning.
  • ABS Plastics: Activation and cleaning processes.
  • LED Packaging: Surface activation and cleaning prior to encapsulation.
  • Ceramic Packaging: Cleaning before electroplating.
  • Mobile Devices: Surface activation and cleaning for phone casings and screens.
  • FPC (Flexible Printed Circuits): Hole desmearing and surface cleaning.
  • Electronic Materials: Surface modification and cleaning.
  • General Plastics: Surface modification and roughening for various plastic materials.
  • ITO Coating: Surface cleaning prior to the coating process.

Specifications

Model LTE-KZ100
Power System Output
RF Power: 0–600W or 0–1000W optional; MF Power: 0–1000W
System Frequency
RF: 13.56MHz; MF: 40KHz
Vacuum Pump
Two-stage rotary vane pump (oil-sealed), 60 m3 / h
Vacuum Piping
All stainless steel piping and high-strength vacuum bellows
Chamber Material
Aluminum alloy; customizable stainless steel chamber
Chamber Thickness
25 mm
Sealing
Military-grade welded seals
Internal Dimensions (W x D x H)
450 x 450 x 500 mm & Customizable
External Control
Start/Stop I/O, RS485 (Optional)
Electrode Size
420 x 411 mm (W x D)
Gap Spacing
22.5 mm
Electrode Layout
Horizontal layout, removable/adjustable
Work Tray
Standard set included; materials: Aluminum or Steel wire mesh
Work Slots
6 slots
Gas Flow Range
0~300 SCCM
Gas Channels
Standard 2-channel; customizable
System Control
PLC
Control Interface
7-inch touch screen
Unit Dimensions(W x D x H)
900 x 1750 x 1000 mm
Weight
200 kg
Exterior Color
Silver Gray
AC Power
AC 380V, 50/60Hz, 5-wire, 50A
Exhaust Flow Rate
2.0 m3 / min
Process Gas
Flow Rate: 1 ~ 10 L/min ; Pressure: 3 ~ 7 kg/cm² ; Pipe Diameter: 6 x 4 mm ; Material: PU pipe ; Purity: 99.99% or higher
Compressed Air
Flow Rate : 1 ~ 10 L/min ; Pressure : 3 ~ 7 kg/cm² ; Pipe Diameter : 8 x 5 mm ; Material : PU pipe ; Dew Point : -40°C or below
Operating Environment Temp.
15 ~ 30°C
Operating Environment Humidity
30 ~ 70%