FLOIL Thermal Compound

Description

KANTO-KASEI’s thermal grease is applied between heat sources and heat sinks to effectively reduce thermal resistance and enhance heat dissipation efficiency.

Features

  • Precision Coating and High Efficiency
    Formulated as a paste, this thermal grease allows for precise control of coating thickness. While it may share the same thermal conductivity value as thermal pads, its heat dissipation efficiency is significantly superior due to better surface contact.

  • Excellent Workability
    The grease can be easily applied using a brush. Unlike adhesives, it supports repeated application (reworkability) while maintaining excellent ease of use throughout the assembly process.

Applications

Issue Recommendation Use Case Examples
PCB board heat dissipation.
Difficulty in attaching thermal sheets.
Standard type (0.83w/m・k)
High thermal conductivity type (2.1w/m・k)
Contact surface between IC and heat sink