Adhesive for Chip Devices (SMT Adhesive)
Description
This series of one-component, heat-curing epoxy resin adhesives is specifically designed for surface mounting chip components (SMT). It is optimized for high-speed manufacturing environments, offering exceptional reliability and processing stability.
Features
- High Heat-resistant Adhesiveness: Maintains superior bonding strength across a wide range of operating temperatures, ensuring components remain secure during and after the soldering process.
- Stable Application Shape: Formulated with optimal thixotropy to maintain precise dot shapes and heights, preventing slumping or stringing during high-speed dispensing.
- High-Speed Processing: Compatible with high-speed dispensers and screen printing, significantly improving production throughput.
Specifications
| Item | NE7300H | NE7200H | NE7250H | NE3300H | NE3300S | NE8800K | NE8800T |
|---|---|---|---|---|---|---|---|
|
Applying Method |
High-speed dispenser Screen printing Thick mask |
Screen printing Thick mask |
High-speed dispenser |
||||
|
Specific Gravity |
1.35 |
1.25 |
1.44 |
1.23 |
1.38 |
1.3 |
1.33 |
|
Viscosity (Pa・s) 25℃ |
320 |
300 |
330 |
310 |
390 |
300 |
310 |
|
Thixotropy Index |
7.1 |
7 |
5 |
6.1 |
5 |
6.8 |
6.3 |
|
Glass transition (℃)DSC |
43 |
116 |
113 |
122 |
131 |
84 |
87 |
|
Curing condition |
100℃/60 sec 90℃/90 sec |
140℃/60 sec 120℃/90 sec |
120℃/60 sec 110℃/120 sec |
140℃/60 sec 130℃/90 sec |
150℃/60 sec 130℃/90 sec |
150℃/60 sec 140℃/90 sec |
150℃/60 sec 130℃/90 sec |
|
Shelf life ＠2~10℃ |
8 mths. |
9 mths. |
7 mths. |
9 mths. |
6 mths. |
6 mths. |
6 mths. |