Conductive Silver Adhesive Series

LETBOND® Conductive Silver Adhesive Series

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Description

The LETBOND® Conductive Silver Adhesive series consists of professional-grade, high-performance electronic adhesives. Formulated with high-conductivity silver fillers integrated into epoxy or acrylate bases, these products are designed for rapid curing at low to medium-high temperatures. They offer low electrical resistivity, high thermal conductivity, superior bonding strength, and excellent resistance to heat and humidity. These adhesives are widely used in semiconductor packaging, optoelectronic modules, ITO films, and metal/ceramic substrates.

Features

  • High Conductivity: Volume resistivity as low as 0.0002 Ω-cm, meeting the most demanding electrical performance requirements.
  • Flexible Curing Conditions: Capable of curing at low temperatures (80°C) or medium-high temperatures (130–150°C) to suit various manufacturing processes.
  • Superior Adhesion: Excellent bonding to plastics, metals, ITO glass, and lens modules.
  • High-Temperature Stability: Thermal stability exceeds 350°C with a water absorption rate below 0.2%, ensuring long-term reliability.
  • Process Versatility: Compatible with screen printing, dispensing, and manual coating; ideal for LED and IC bonding applications.

Applications

  • 9008EC-08: Ideal for lead frames, plastic, and metal packaging. Specifically designed for electronic components that must withstand lead-free soldering processes (260°C).
  • 9008EC: Suitable for ITO glass, ITO films, and glass substrates; widely used for optoelectronic conductive film bonding.
  • 9018EC: Specifically formulated for lens module conductive and structural applications, providing stable adhesion to optical components.
  • 9050EC: Features high shear strength and low resistance. Perfect for LED chip attachment, IC bonding, and aluminum/copper/ceramic substrates. Supports both screen printing and dispensing processes.

Selection Specifications

Model Color Viscosity (cps) Electrical Resistivity Curing Time
(°C / min)
9008EC-08
Silver Paste
7,000 ~ 15,000 (5 rpm)
< 0.0003 Ω
80°C / 120min ; 100°C / 60min
120°C / 50min ; 150°C / 40min
9008EC
Silver Paste
9,000 ~ 13,000 (20 rpm)
< 0.015 Ω
80°C / 60min ; 130 – 140°C / 30min
9018EC
Silver Paste
25,000 ~ 31,000 (20 rpm)
< 0.015 Ω
80°C / 120min ; 130 – 150°C / 30min
9050EC
Silver Paste
20,000 ~ 40,000 (20 rpm)
0.0002 Ω
130°C / 60min ; 150°C / 30min

Notes:

  • The values above are for reference only; actual values are based on the Certificate of Analysis (COA) of the shipped batch.