Thermal Grease & Gel

LETBOND® Thermal Interface Materials (Thermal Grease & Gel)

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Description

The LETBOND® Thermal Interface Materials series includes high-performance Thermal Grease and Thermal Gel. These single-component, ready-to-use materials are designed to fill microscopic or irregular gaps between electronic components and heat sinks, with a Bond Line Thickness (BLT) ranging from 0.01 mm to 1.5 mm. By significantly reducing interfacial thermal resistance, these products rapidly dissipate heat to the external environment, ensuring that high-power and high-heat-flux devices operate stably and safely under peak performance conditions.

Formulated with eco-friendly raw materials, these products feature low volatility and low metal doping. They offer excellent anti-slump properties, vibration damping, and electrical insulation. Certain models also act as a moisture buffer, further improving interface contact and insulation for semiconductor devices. They are widely used across consumer electronics, telecommunications, servers, industrial controls, and new energy sectors.

Features

  • High Thermal Conductivity: A wide range of conductivity from 0.9 W/m·K to 12.5 W/m·K to meet requirements from low-power to high-power components.
  • Exceptional Reliability: Low volatility, low oil bleed, and low compression stress. Designed to prevent “pump-out” effects, material degradation, or thermal performance decay.
  • Ease of Application: Single-component, paste-like consistency allows for easy coating, making it ideal for mass production or precision assembly.
  • Superior Insulation: High volume resistivity and dielectric strength (> 6 kV/mm) eliminate the risk of leakage or electrical breakdown.
  • Broad Environmental Adaptability: Operates across a wide temperature range (-50°C to +200°C), suitable for consumer, telecom, automotive, industrial, and aerospace applications.
  • Safety Compliance: Most models meet the UL94 V-0 flame retardancy standard, minimizing fire risks.

Applications

  • 3300 Thermal Grease: A traditional TIM suitable for transistors, diodes, rectifiers, power resistors, and general semiconductor cooling.
  • 33065 / 33080: Designed for consumer electronics and wearables (laptops, smartphones, smartwatches), providing mid-to-high efficiency heat transfer.
  • 33090: Optimized for telecom equipment (4G/5G RRU/AAU), servers, and data centers, supporting high-computation and long-term stability.
  • 33095: Features an ultra-thin BLT (0.01 mm), ideal for high-heat-flux components such as HPC servers, power supplies, and new energy applications (EVs/blockchain mining).
  • 33120: Ultra-high thermal performance (12.5 W/m·K) for high-power electronics, military, and medical equipment, suitable for TIM1/TIM2 applications in harsh environments.

Selection Specifications

Model Color Thermal Conductivity Density Application Thickness Operating Temp Volume Resistivity Flame Class
3300
White
0.9 W/m·K
2.10 g/cm³
Paste
-50 ~ 200 °C
1.5 x 1014 Ω·cm
–
33065
Blue
6.5 W/m·K
2.79 g/cm³
0.13 BLT, mm
-50 ~ 160 °C
5 x 1012 Ω·cm
UL 94V-0
33080
Light Pink
8.0 W/m·K
3.3 g/cm³
0.2 BLT, mm
-50 ~ 150 °C
1013 Ω·cm
UL 94V-0
33090
Blue
9.0 W/m·K
3.2 g/cm³
0.2 BLT, mm
-40 ~ 150 °C
2.8 x 1013 Ω·cm
UL 94V-0
33095
Grey
9.5 W/m·K
2.7 g/cm³
0.01 BLT, mm
-45 ~ 200 °C
> 1012 Ω·cm
UL 94V-0
33120
Grey
12.5 W/m·K
3.3 g/cm³
0.3 BLT, mm
-40 ~ 150 °C
2.0 x 1013 Ω·cm
UL 94V-0

Notes:

  • The values above are for reference only; actual values are based on the Certificate of Analysis (COA) of the shipped batch.