Single-Component Structural

LETBOND® Single-Component Structural Adhesives

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Description

The LETBOND® Single-Component Structural Adhesives are high-performance epoxy-based formulations designed for industrial automation. These ready-to-use adhesives eliminate the need for mixing, offering superior processing stability and compatibility with automated production lines. The product range includes low-temperature fast-cure, high-strength heat-resistant, and extended-work-life variants. These are widely utilized in electronic components, SMT assembly, motor/transformer encapsulation, metal-to-plastic bonding, PCB reinforcement, and optical module fixing.

Features

  • Ease of Use: Most products feature a user-friendly 1:1 mix ratio (by volume) and cure naturally at room temperature after mixing.
  • High Strength: Delivers a combination of high tensile strength and superior lap shear strength on metal substrates.
  • Environmental Resilience: Provides outstanding resistance to high temperatures, chemicals, solvents, and moisture.
  • Broad Compatibility: Specifically engineered to bond most engineering plastics (ABS, PVC, FRP, etc.) and metals (Aluminum, Stainless Steel, Iron).
  • Electrical Properties (Epoxy): High volume resistivity and dielectric strength make these ideal for potting and securing electronic/electrical components.

Applications

  • 3148: Display bezel bonding; bonding of dissimilar materials (metal to plastic); designed for vibration-prone environments.
  • 3512: SMT component fixing; low-temperature fast curing; ideal for printing or dispensing processes.
  • 3514: Bonding of piezoelectric ceramics, cobalt-nickel alloy plating, and high-temperature resistant plastics.
  • 3590: CCM (Camera Control Module) encapsulation, memory cards, CMOS, and sensors; supports low-temperature fast curing.
  • 3613G: Automotive motor potting and coating; suitable for high-temperature and electrical insulation applications.
  • 3613: Coating and sealing for industrial electronic components; features excellent chemical resistance and electrical performance.
  • 3618: Connector bonding; supports low-temperature fast curing.
  • 3625 / 3625W: Transformer encapsulation; provides high-temperature resistance and electrical insulation.
  • H3581: Camera module holder fixing; optimized for low-temperature manufacturing processes.
  • JS08-G7 / MO: High-reliability PCB reinforcement; fatigue resistant and low halogen.
  • RES08-BL7 / G7 / W7: PCB transplant reinforcement and general board reinforcement; characterized by high strength and high-temperature resistance.

Selection Specifications

Low-Temperature Fast-Curing Series
Model Color Viscosity (cps) Curing Conditions Hardness (Shore) Temp. Range
(°C)
3148
Black Liquid
4,500 – 15,500
80℃ / 10–15 min
68
-40~120
3152
Grey Paste
38,400 – 315,600
90℃ / 3 min
73
-40~120
3590
Black Thick Paste
30,000 – 200,000
65℃ / 60 min 70℃ / 30 min
77
-20~120
3618
Black Paste
40,000 – 700,000
80℃ / 30 min
68
-40~80
H3581
Black Thick Paste
40,000 – 500,000
80℃ / 30 min
68
-20~120
Model Color Viscosity (cps) Curing Conditions Hardness (Shore) Temp. Range
(°C)
3514
Grey Paste
> 1,000,000
121℃ / 40 min 149℃ / 10 min
85
-53~177
3625
Black Paste
Paste-like
80℃ / 60 min 120℃ / 120 min
85
-40~120
3625W
White Paste
Paste-like
80℃ / 60 min 120℃ / 120 min
85
-40~120
3613G
Grey Paste
> 500,000
80℃ / 60 min 120℃ / 120 min
90
-40~120
3613
Black Paste
432k–648k
80℃ / 2hr 120℃ / 2hr
85
-40~120
Model Color Viscosity (cps) Curing Conditions Hardness (Shore)
JS08-G7
Green Thick Paste
5,700–15,000
135℃ / 60 min
80
JS08-MO
Blue-Green Thick Paste
7,200–16,000
135℃ / 60 min
82
RES08-BL7
Black Thick Paste
7,200–16,000
135℃ / 60 min
82
RES08-G7
Green Thick Paste
5,700–15,000
135℃ / 60 min
80
RES08-W7
White Thick Paste
7,500–12,000
135℃ / 60 min
84

Notes:

  • The values above are for reference only; actual values are based on the Certificate of Analysis (COA) of the shipped batch.